HENKEL LOCTITE CORPORATION

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B29B PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS 324
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM3154
 
  
 
C08J WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER- TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C C08F, C08G or C08H 276
 
  
 
D02G CRIMPING OR CURLING FIBRES, FILAMENTS, YARNS, OR THREADS; YARNS OR THREADS128
 
  
 
F16J PISTONS; CYLINDERS; PRESSURE VESSELS IN GENERAL; SEALINGS149
 
  
 
F16L PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL169
 
  
 
G06K RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS 1197
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 1361
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 1155

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
6688607 Material for sealing threaded pipe joints, and dispenser thereforMay 29, 02Feb 10, 04[F16L, D02G, F16J]
D485480 Tube holderJul 25, 02Jan 20, 04[0805]
RE37491 Information storage medium and method for detecting forgeriesJun 02, 00Jan 01, 02[G06K]
6274389 Mounting structure and mounting process from semiconductor devicesJul 08, 99Aug 14, 01[H01L]
5912805 Thermal interface with adhesiveNov 04, 98Jun 15, 99[H05K]
5783272 Expandable films and molded products therefromFeb 05, 96Jul 21, 98[B29B]
5665461 Low moisture absorption syntactic foamSep 15, 92Sep 09, 97[C08J]
5540963 Expandable films and molded products therefromMar 07, 95Jul 30, 96[B29B]
5470413 Process of making a lighting strike compositeMar 07, 95Nov 28, 95[B32B]
5397611 Expandable films and molded products therefromAug 10, 93Mar 14, 95[B29B]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
7482047 Delaminated multilayered containerExpiredFeb 04, 03Jan 27, 09[B29C, B29D, B65D]
7125935 Ion exchange materialsExpiredMar 21, 01Oct 24, 06[C08F]
6874249 Continuous path variable width light attenuation device for electromagnetic energy spot cure systemExpiredSep 29, 03Apr 05, 05[F26B]
2005/0042,961 Curable compositions for advanced processes, and products made therefromAbandonedAug 18, 03Feb 24, 05[B32B]
2004/0225,045 Highly conductive resin compositionsAbandonedMay 05, 03Nov 11, 04[C08K]
2004/0166,241 Molding compositions containing quaternary organophosphonium saltsAbandonedFeb 20, 03Aug 26, 04[B05D]
2004/0166,325 Flame retardant molding compositions containing group IVA metal oxidesAbandonedAug 19, 03Aug 26, 04[B32B]
6712910 Rinsewater separable and recyclable heat curing impregnation compositionsExpiredAug 14, 01Mar 30, 04[C23G]
6710021 Non-staining, active metal-working fluidExpiredJul 25, 02Mar 23, 04[C10M]
2004/0010,111 Adhesives for dvd bondingAbandonedMay 14, 03Jan 15, 04[C08G]
6676795 Bonded assembly and method for preparing sameExpiredJul 30, 01Jan 13, 04[B32B]
6673192 Multi-amine compound primers for bonding of polyolefins with cyanoacrylate adhesivesExpiredSep 25, 97Jan 06, 04[B32B]
6670430 Thermosetting resin compositions comprising epoxy resins, adhesion promoters, and curatives based on the combination of nitrogen compounds and transition metal complexesExpiredNov 20, 00Dec 30, 03[C08F, C08L]
6652705 Graphitic allotrope interface composition and method of fabricating the sameExpiredMay 18, 00Nov 25, 03[B32B, C08K]
2003/0208,016 Radical polymerizable compositions containing polycyclic olefinsAbandonedJan 27, 03Nov 06, 03[C08F]
6632893 Composition of epoxy resin, cyanate ester, imidazole and polysulfide toughenersExpiredNov 19, 01Oct 14, 03[H01L, C08L]
6632908 Bonding system having adherence to low energy surfacesExpiredMar 12, 02Oct 14, 03[C08F]
6627683 Reworkable thermosetting resin compositions and compounds useful thereinExpiredSep 05, 00Sep 30, 03[C08L, C08K]
6616999 Preapplicable phase change thermal interface padExpiredMay 17, 00Sep 09, 03[H01B, F28F, B32B]
6617399 Thermosetting resin compositions comprising epoxy resins, adhesion promoters, curatives based on the combination of nitrogen compounds and transition metal complexes, and polysulfide toughenersExpiredNov 19, 01Sep 09, 03[C08F, C08L]

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